On December 13, 2025, Success(Jiangsu) Semiconductor Equipment Technology Co., Ltd. reached a major milestone in the field of advanced packaging equipment. The company’s 4.5G glass-based TGV advanced coating equipment completed production debugging and was officially shipped for delivery to a leading domestic advanced packaging enterprise.
This shipment involves a TGV electroplating equipment tailored for the 4.5th-generation line (G4.5), featuring a large panel size of 730*920mm. This achievement marks the company's technological iteration and sustained mass production capability. Compared to traditional small-sized panels (such as 510*515mm), the 730*920mm "large panel level" significantly increases the number of chips produced per batch, substantially reducing unit costs. It represents a critical step toward large-scale commercial application.