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Success fully automated wafer wet processing equipment has completed the entire delivery process.
The shipped full-line automated solution cleaning equipment supports 8-inch and 12-inch wafers. It enables rapid switching between various wet processes such as degumming, cleaning, etching, and stripping, and is suitable for application scenarios including logic, memory, power devices, and advanced packaging.
- Previous：
- The Success Semiconductor 4.5G Glass-Based TGV Advanced Coating Equipment Successfully Shipped
- Under：
- nodata
139 6265 8938
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